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Failure of IGBT (Insulated Gate Bipolar Transistor) happens due to overcurrent conditions causing thermal stress, overheating, or voltage spikes leading to the breakdown of the semiconductor junctions. IGBT modules are power semiconductor devices used for switching high voltage and high current loads in various applications, such as motor drives, renewable energy systems, industrial automation, and traction systems in transportation. An IGBT module is a compact and integrated solution for power switching, combining multiple IGBTs, diodes, and necessary protection and control circuitry in a single package. These modules play a vital role in various industries and applications where efficient and precise control of high-power electrical current is required. Some common usages of IGBT modules include motor control applications, solar inverters, wind turbines, robotics, power supply, welding equipment, UPS systems and onboard charging systems for electric vehicles (EVs).

Failure of IGBT

Gate overvoltage

•  Gate oscillation
•  External surges
•  Gate driver anomalies

 Corrosion

•  Flashover due to the formation of the conductive path
•  Chemical reaction due to humidity

  Collector emitter overvoltage

•   Unexpected load
•   Surges
•   Issues in control signals

 Thermal faults

•   Faults
•   Gate drive faults
•   Package degradation
•   Cooling system faults
•   Control faults

 Manufacturing defects

•   Bond wires defects
•   Solder defects
•   DBC insulation defects
•   Metallization defects

Over current

•    Faults
•    Improper control actions
•    Unexpected load

Various industries use IGBT modules because of their high power handling capability, efficient switching characteristics, and versatility.

Who should use the Failure of IGBT template?

• The fishbone diagram can help stakeholders identify reasons for Insulated Gate Bipolar Transistor failure.

Why use this template?

• Using an RCA Fishbone diagram for IGBT failure helps identify root causes such as overcurrent events, voltage surges, thermal stress, manufacturing defects, or inadequate cooling, enabling targeted corrective actions to improve reliability and prevent future failures.
• Design and extend your template or reuse this with some modification for cause analysis of other problems in ProSolvr by smartQED.

Curated from community experience and public sources:

• https://www.researchgate.net/publication/348304765_A_Review_on_IGBT_Module_Failure_modes_and_Lifetime_Testing
• https://iopscience.iop.org/article/10.1088/1742-6596/1754/1/012036/pd